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0 - 200 GB
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Total votes: 34

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Industry & Technology

New 17-inch LG Gram laptop weighs 2.9 pounds, has nearly 20-hour battery life

Ars Technica - 25 min 28 sec ago

LG

We're just a few weeks away from 2019's Consumer Electronics Show (CES), and some companies are drumming up hype by revealing some new products early. LG is one of them, as it announced the newest devices in its Gram family of thin-and-light laptops. Joining the lineup are a new 17-inch LG Gram, which the company claims to be the lightest 17-inch clamshell on the market, and the family's first 2-in-1 device in the form of the new 14-inch Gram convertible.

The mammoth 17-inch laptop appears to take most of its design from the original LG Gram, which Ars reviewed last year. It looks like a standard ultrabook, with a nearly edge-to-edge display and a slightly larger chin bezel. LG claims to have put a 17-inch display in a 15.6-inch chassis, but it's hard to tell how well that statement holds up through images alone.

Read 7 remaining paragraphs | Comments

Intel promises big boost to integrated GPU, breaks teraflop barrier

Ars Technica - 32 min 16 sec ago

Enlarge / 64 little grey boxes means 64 execution units, up from 24. (credit: Intel)

Intel is promising a huge improvement to the performance of its integrated GPUs. Its generation 11 ("Gen11") GPU will more than double the execution units from (usually) 24 to 64, and in so doing boost the number-crunching performance to more than 1 trillion floating point operations per second.

Just as the current Gen9 GPUs, Gen11 is arranged into blocks combining execution units (EUs) with dedicated 3D hardware such as texture samplers. Gen9 parts have up to 8 EUs per block, and the most-common configuration found in Intel's processors, GT2, has three such blocks for a total of 24 EUs (though there are designs with six or nine blocks, for 48 or 72 EUs). Gen11 has 16 EUs per block and will have configurations with four blocks. It's all these extra execution units that enable that headlining 1TFLOPS performance figure.

The new GPU will use a tile-based rendering approach, which divides the image into tiles that are all rendered separately. This tends to reduce the amount of memory bandwidth the GPU needs, which is valuable in integrated GPUs, as they lack the high-performance memory found in discrete parts. The Mali GPUs designed by ARM, along with Qualcomm's Adreno GPUs, both use tile-based rendering too.

Read 3 remaining paragraphs | Comments

The Galaxy S10 could roll in all these Snapdragon 855 features - CNET

cNET.com - News - 46 min 12 sec ago
It's up to Samsung. We went hands-on with new features in the Snapdragon 855 chip.

Nintendo Switch Bundle for $340, Xbox One for $219, iPad for $250, Fire TV Stick for $25: Best deals since Black Friday - CNET

cNET.com - News - 52 min 10 sec ago
Black Friday is over, but sales are everywhere. Walmart has a solid Switch deal, Google's Pixel 3 price-drop is back and the new iPad is still just $250 at Target.

Intel unveils a new architecture for 2019: Sunny Cove

Ars Technica - 1 hour 46 sec ago

OK, it's not all that sunny, but it's a nice picture of a cove. (credit: Neil Williamson)

In 2019, Intel will release Core and Xeon chips built around a new architecture: the chips will add a bunch of new instructions to accelerate certain popular workloads such as cryptography and compression, with the company demonstrating 75-percent improvement in compression performance relative to prior-generation parts.

Since 2015, Intel's mainstream processors under the Core and Xeon brands have been based around the Skylake architecture. Intel's original intent was to release Skylake on its 14nm manufacturing process and then follow that up with Cannon Lake on its 10nm process. Cannon Lake would add a handful of new features (it includes more AVX instructions, for example) but otherwise be broadly the same as Skylake.

However, delays in getting its 10nm manufacturing process running effectively forced Intel to stick with 14nm for longer than anticipated. Accordingly, the company followed Skylake (with its maximum of four cores in consumer systems) with Kaby Lake (with higher clock speeds and much greater hardware acceleration of modern video codecs), Coffee Lake (as many as eight cores), and Whiskey Lake (improved integrated chipset). The core Skylake architecture was unchanged across these variations, meaning that while their clock speeds differ, the number of instructions per cycle (IPC) is essentially identical.

Read 8 remaining paragraphs | Comments

Facebook revamps feature to highlight life milestones - CNET

cNET.com - News - 1 hour 1 min ago
Expecting a baby or buying a new car? The tech firm wants you to highlight these big moments.

Intel introduces Foveros: 3D die stacking for more than just memory

Ars Technica - 1 hour 1 min ago

Enlarge / P1274 is Intel's name for its high performance 10nm process. P1222 is its 22FFL (22nm, FinFET, Low Power) process, which is optimized for much lower current leakage. As well as the Foveros connection between the compute and I/O modules, the product will use conventional stacked Package-on-Package memory. (credit: Intel)

In 2019, Intel is going to ship chips using a new 3D stacking technology the company is calling Foveros. Foveros allows complex logic dies to be stacked upon one another, providing a much greater ability to mix and match processor components with optimal manufacturing processes.

Package-on-package stacking is already commonplace in the system-on-chip world. Typically, this involves sticking a memory package on top of a processor, with perhaps a few hundred connections between the two. The size and performance of the connections has limited the application of this technique. With Foveros, the interconnect will use etched silicon (just as EMIB does) to enable many more interconnections, running at much greater speeds.

Foveros follows on from Intel's EMIB (Embedded Multi-die Interconnect Bridge) tech. EMIB is found on the Kaby Lake-G processors that in a single package contain an Intel CPU, AMD GPU, and a chunk of second-generation High Bandwidth Memory (HBM). HBM achieves its high bandwidth by using thousands of interconnects between the GPU and its memory, in comparison to the several hundred used between a GPU and conventional GDDR. The Kaby Lake-G chips use EMIB to provide this connection.

Read 5 remaining paragraphs | Comments

Snapdragon 855 demos hint at what you could do on Galaxy S10, Pixel 4 - CNET

cNET.com - News - 1 hour 1 min ago
Qualcomm's next chip is coming to future Samsung and Google phones.

Having swallowed its pride and started again with 10nm chips, Intel teases features in these 2019-ish processors

The Register - 1 hour 1 min ago
3D stacks of Arm-like core clusters, APIs, and more coming some time soon

"We have humble pie to eat right now, and we're eating it," Murthy Renduchintala, Intel's chief engineering officer, said yesterday. "My view on [Intel's] 10nm is that brilliant engineers took a risk, and now they're retracing their steps and getting it right."…

Intel 3D chip stacking could get you to buy a new PC - CNET

cNET.com - News - 1 hour 1 min ago
The chipmaker promises breakthrough performance.

Twitter's Jack Dorsey answers critics of Myanmar meditation retreat

BBC Technology News - 1 hour 10 min ago
Twitter's chief executive says he needs to learn more about the plight of the Rohingya in Myanmar.

Samsung trademarks hint that upcoming phones may be called Rize - CNET

cNET.com - News - 1 hour 18 min ago
It's reportedly applied to trademark the terms Rize10, Rize20 and Rize30.

Elon Musk sounds crazy, but his ideas might just work - CNET

cNET.com - News - 1 hour 23 min ago
He's got a knack for cooking up ideas that sound like they come from comic books.

Download this free Microsoft Office alternative, help charity - CNET

cNET.com - News - 1 hour 25 min ago
For a limited time, SoftMaker will donate 10 cents to charity for every FreeOffice download. It's available for Windows, Linux and Mac. Plus: The last good Nintendo Switch bundle before Christmas?

Google CEO hearing could have covered so much more ground - CNET

cNET.com - News - 1 hour 28 min ago
Dragonfly, the search giant’s controversial China project, got too little of the spotlight, some observers say.

Need continuous Kubernetes satisfaction? CloudBees has just the thing

The Register - 1 hour 46 min ago
DevOps outfit also unleashes commercial support for Jenkins X

The gang at DevOps darlings CloudBees have been busy, er, bees and flung out a new continuous delivery product for Kubernetes development in the form of Core while also kicking off commercial support for Jenkins X.…

Hey, stop shaming me for my old phone and paper map - CNET

cNET.com - News - 2 hours 1 min ago
You don't need to ditch paper for screens and constantly upgrade your phone to be cool. Old is OK.

How movie editing takes a script and makes a whole new film - CNET

cNET.com - News - 2 hours 1 min ago
"Editing is really the final rewrite for all movies," says Tom Cross, editor of flicks like space race epic First Man. CNET chats with Cross about the process.

Best iPhone XS and XS Max cases - CNET

cNET.com - News - 2 hours 1 min ago
Need some protection for your new XS or XS Max? Here are bunch of top cases to check out, all of them compatible with wireless charging.

The 2018 XPS 13 Developer’s Edition—Have it your way on “just works” Linux laptop

Ars Technica - 2 hours 1 min ago

Valentina Palladino

It has been six years since Dell first introduced its XPS Developer Edition moniker, which refers specifically to the company's XPS laptop models that ship with Ubuntu Linux (and not Windows) pre-installed. Ever since, Dell has been producing some of the best Linux "ultrabooks" in recent memory.

Ars has already put the Windows-boasting XPS 13 through its paces earlier this year since the device received a serious overhaul in 2018. Dell bumped up the hardware specs, revamped the thermal system, and introduced a new rose and white version, for instance. But how is latest edition of the premier "just works" Linux laptop doing with the added muscle?

Read 30 remaining paragraphs | Comments


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